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Metrology and Laboratory

NEW! Portable X-Ray Residual Stress Analyzer by Pulstec

December 03, 2019
NEW! Portable X-Ray Residual Stress Analyzer by Pulstec

Introducing a new product for residual physical stress analysis, the (micro) µ-X360S from Pulstec Industrial!


µ-X360S is an X-ray analyzer of residual stress in polycrystalline materials (molecules organized periodically -crystalline- or in aggregates of small crystals), such as:

  • Metals (iron, steels, zinc, copper, aluminum, bronze, titanium ...) *
  • Ceramics (Silicon Nitride, CBN, Semiconductors, Cermets ...)

*Different materials may require different X-ray emitters. These are interchangeable components of the device. Request more information here, with a sales agent.


The µ-X360S allows the non-destructive analysis of stress and hardness in places and parts or products that by their nature cannot be analyzed in the laboratory because their fragmentation or destruction is prevented, and / or that cannot be transported outside the workplace. or production; for example:

  • Structural steel: beams, rails, profiles, joints, brackets, wells, panels ...
  • Pailería: tanks, pipes, heat exchangers ...
  • Aluminum and other structural alloys: construction, aircraft and spacecraft ...
  • Metallurgy and foundry: beams (billet), plates (slabs), ingots ...
  • Machining: injection molds.

The portability lies in its compact design with a total weight of 10 kilos (scanner and power source), in addition to its low power (45W) makes it very safe to use; It has no theoretical limit for the size of the piece to be measured, and the battery gives it an operating capacity of up to 6 hours. This makes it the ideal residual stress analyzer for the construction, infrastructure, shipyard, aerospace and foundry industries, not only for finished products, but also as an ally for the structural maintenance of functional products such as ships, bridges, structures, aircraft and injection molds.

But in addition, the versatility of the µ-X360S analyzer makes it useful as part of the laboratory for medium or small parts in which destructive analysis can alter stress results:

  • Automotive parts: transmissions and clutchs, camshafts, pistons, connecting rods, chassis, augers, steering rods, etc.
  • Damping and bearings: Springs, springs, guides, gears and other flexible metal components.
  • Heat and surface treatment: tempering, annealing, tempering, grinding, pickling, etc.

Prevent and anticipate faults, deformations or fissures; improve the quality and performance of its production and maintenance processes. The µ-X360S is useful for a wide variety of industries: construction, shipyards, heavy industry, aerospace, petrochemicals (containers and pipes), metallurgy and foundry, metalworking, etc.

Types of Measurement:

The µ-X360S uses the principle of X-ray diffraction from the crystalline structure according to Bragg's law: nλ = 2d Sin (θ) (first Cosα method), where the orientation of the different crystals of the material due to stress generates a different angle of diffraction in relation to the incidence of X-rays, this in turn generating the data to represent the Debye ring (the penetration depth is 10 µm or more depending on the characteristics of the surface).

The results are shown as a graphical representation of the Debye rings (showing the size and orientation of the crystals), calculation of residual stress in Mpa's, statistical data FWHM (Width at Medium Height) and optionally percentage calculation of austenite (optional), all which can be archived (along with the sample photo) for future reference. All these data allow a quick visual evaluation of the sample.

Other applications:

Total improvement of the machining process.

Manufacture of metal parts, µ-X360S helps you to fully monitor the process, allowing you to identify the part of the process where there are problems of residual stress failures, identifying in which part of the manufacturing the structural failure is generated.

Life time control of injection molds.

The µ-X360 allows you, through the analysis of residual stress, to reduce repair costs by identifying with time the changes in value in the mold stress parameters, thus avoiding mold failures and loss of production due to quality problems.

In addition, analyze the repairs with welding in your molds, reducing maintenance costs and ensuring the correct performance of your welding.

Features of µ-X360S

  • Non-destructive and non-contact measurement:
    • Stress can be measured without damaging the parts.
    • Easy device positioning
  • Easy and fast measurement operation:
    • Measurement in 60 seconds (ferrite)
    • Simple report printing
    • Camera and LED marker for positioning
  • Lightweight, compact and low energy consumption:
    • The smallest in the market (10 kg)
    • Portable (with conveyor box for standard unit)
    • Outdoor battery up to 6 hours (150W)
  • High repeatability:
    • Information presented with Debye rings
    • Contactless hardness analysis
    • Grain orientation display
  • Safe design, low power but high sensitivity
    • Low power X-rays (45W)
    • 3m safety radius when active (0.1µSv / h @ 3m)
    • Operation alarm when active
  • Optional Adjuncts
    • Interlock security cabinet (custom design) for laboratory use
    • Flexible magnetic arm
    • Microscope camera for positioning
    • X-Y robotic arm
    • Electrochemical surface cleaning kit

We invite you to learn more about this analysis tool with your sales agent; click here to request a quote, or, you can click here to download the official product catalog.

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